PA66 GF30 vs PI (Polyimide): 0% composition overlap. Significantly different materials serving different application areas.
PA66 GF30 vs PI (Polyimide)
Side-by-side chemical composition and mechanical property comparison.
Overview
PA66 GF30
Polyamide 66 with 30% short glass fiber — stronger and more heat-resistant than PA6 GF30 due to higher-Tm base polymer. UTS ~190 MPa dry, HDT ~250°C. THE automotive under-hood material for structural brackets. Trade names include Ultramid A3WG6 (BASF), Zytel 70G30 (DuPont), Durethan AKV 30 (LANXESS), Technyl A218 V30 (Domo). Used for engine brackets, radiator end tanks, air intake manifolds, and electrical connectors.
PI (Polyimide)
Polyimide — THE extreme-temperature polymer. Continuous use 250-300°C (short-term to 400°C+). Outstanding thermal stability, low outgassing, excellent radiation resistance, and self-lubricating. Available as film (Kapton, DuPont), parts (Vespel, DuPont), and moldable resin. Expensive but irreplaceable where no other polymer survives. Used for aerospace bearings/seals, semiconductor processing, flexible circuit boards (Kapton), jet engine components, and space applications.
| PA66 GF30 | PI (Polyimide) | |
|---|---|---|
| Material Number | — | — |
| Category | Polymers | Polymers |
| Standard | ISO 10350 | ASTM D638 |
Chemical composition (wt%) — Pro
| Element | PA66 GF30 | PI (Polyimide) | Overlap |
|---|---|---|---|
| Polyamide 66 (Base Polymer) | 68–72% | — | — |
| Glass Fiber Reinforcement | 28–32% | — | — |
| Base Polymer (Polyimide) | — | 99–99.9% | — |
Mechanical properties — Pro
| Property | PA66 GF30 | PI (Polyimide) | Unit |
|---|---|---|---|
| Tensile Strength | 185–200 | 72–120 | MPa |
| Elongation | 3–4 | 7–30 | % |
| Elastic Modulus | 9.5–11 | 2500–4000 | GPa |
| Density | |||
| hdt_1_8mpa | |||
| Melting Point | |||
| Tensile Strength | |||
| Tensile Modulus | |||
| Elongation at Break | |||
| Charpy Impact (notched) | |||
| Density | |||
| Melting Point | |||
| HDT/A (1.8 MPa) | |||
| Water Absorption (24h) | |||
| Glass Fiber Content | |||
| continuous_service_temp |
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PA66 GF30 and PI (Polyimide) have significantly different compositions (0% overlap). These materials are not interchangeable and serve different application areas.
Automated assessment based on composition analysis
Frequently Asked Questions
Is PA66 GF30 the same as PI (Polyimide)?
PA66 GF30 and PI (Polyimide) have a 0% composition overlap. They are generally not directly interchangeable.
Can I replace PA66 GF30 with PI (Polyimide)?
Generally not recommended. The compositions differ significantly (0% overlap). These materials have different alloying concepts and are intended for different applications.
What is the difference between PA66 GF30 and PI (Polyimide)?
The main differences are in the following elements: overall alloying content. PA66 GF30 is a Polymers grade, while PI (Polyimide) is a Polymers grade.
Related Comparisons
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Data provided for reference only. Always verify against the applicable specification for critical applications.
All data is for reference only. Equivalents indicate similarity, not identity. Always verify against the applicable specification for safety-critical applications. materialref.com accepts no liability for decisions based on this data.